ABF Substrate (FC-BGA) Market

The FC-BGA substrate market is expected to witness significant growth in the coming years. The increasing demand for miniaturized and high-performance electronics, such as smartphones and tablets, is one of the major factors driving the growth of the market. Additionally, the growing demand for advanced devices, such as autonomous vehicles and medical devices, is anticipated to fuel the demand for FC-BGA substrates. Moreover, the increasing development of thinner and lighter electronic devices, owing to the growing demand for enhanced portability, is expected to drive the growth of the market.
ABF Substrate (FC-BGA) Market segments analysis

The global ABF substrate (FC-BGA) market can be segmented based on product type, application, and region. Based on product type, the market can be divided into single-sided, double-sided, and multilayer ABF substrates. Double-sided ABF substrates are expected to account for the largest market share, owing to their increasing application in consumer electronics, medical devices, automotive, and other industries.

Based on application, the ABF substrate (FC-BGA) market can be categorized into consumer electronics, automotive, industrial, medical, and others. The consumer electronics segment accounted for the largest market share in 2019 and is expected to maintain its dominance during the forecast period, owing to the increasing demand for ABF substrates for smartphones, tablets, and other consumer electronics.

Regionally, the ABF substrate (FC-BGA) market can be segmented into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa. Asia Pacific is expected to hold the largest market share during the forecast period, owing to the increasing demand for consumer electronics in the region. Moreover, the presence of major players in the region is also expected to drive the growth of the market in Asia Pacific. 

ABF Substrate (FC-BGA) Market companies

Some of the major players operating in the global ABF substrate (FC-BGA) market are ASE Group, STATS ChipPAC, AT&S, TTM Technologies, Samsung Electronics, Unimicron, Ibiden, Tripod Technology, Nanya Printed Circuit Board Corporation, and Compeq Manufacturing.